Bonding with the Solid-Liquid Interdiffusion (SLID) process
The aim of this project is to study the SLID bonding process in order to achieve hermetic seals. Two metallic layers with respectively high and low melting points are brought together into intimate contact. By diffusion, first in the liquid phase and then in the solid phase, one or more intermetallic compounds are formed whose re-melting temperature are generally between the melting points of the two initial materials. Bonds can thus be made at a low temperature and subsequently withstand higher temperature of use. Process time and temperature depend on the growth kinetics of the intermetallic phases that are formed. The Au-In and Au-In-Ni systems are first investigated and the bonds are characterized by scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDX).